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Gigabyte B760M DS3H AX DDR4 Motherboard

Gigabyte
  • Intel® Socket LGA 1700：Support 13th and 12th Gen Series Processors
  • Unparalleled Performance：Hybrid 6+2+1 Phases Digital VRM Solution
  • Dual Channel DDR4：4*DIMMs XMP Memory Module Support
  • Next Generation Storage：2*PCIe 4.0 x4 M.2 Connectors
  • M.2 Thermal Guard：To Ensure M.2 SSD Performance
  • EZ-Latch：PCIe 4.0×16 Slot with Quick Release Design
  • Fast Networks：2.5GbE LAN & Wi-Fi 6E 802.11ax
  • Extended Connectivity：Rear USB-C® 10Gb/s, DP, HDMI
  • Smart Fan 6：Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
  • Q-Flash Plus：Update BIOS Without Installing the CPU, Memory and Graphics Card

₹14,350 ₹15,200

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B760M DS3H AX DDR4 Support 13th and 12th Gen Series Processors, Dual Channel DDR4 Memory. 2 x M.2 Ultra Storage Performance Connectors, 6+2+1 Hybrid Digital VRM Design

Features:

  • Intel® Socket LGA 1700：Support 13th and 12th Gen Series Processors
  • Unparalleled Performance：Hybrid 6+2+1 Phases Digital VRM Solution
  • Dual Channel DDR4：4*DIMMs XMP Memory Module Support
  • Next Generation Storage：2*PCIe 4.0 x4 M.2 Connectors
  • M.2 Thermal Guard：To Ensure M.2 SSD Performance
  • EZ-Latch：PCIe 4.0×16 Slot with Quick Release Design
  • Fast Networks：2.5GbE LAN & Wi-Fi 6E 802.11ax
  • Extended Connectivity：Rear USB-C® 10Gb/s, DP, HDMI
  • Smart Fan 6：Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
  • Q-Flash Plus：Update BIOS Without Installing the CPU, Memory and Graphics Card

6+2+1 Phases Hybrid Digital VRM Design
• 6+2+1 Phases Low RDS(on) MOSFETs
• Premium Choke and Capacitors to improve transient response and minimize oscillation

GIGABYTE Ultra-Efficient M.2 Thermal Guard
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.

Category: Tags: , , , , , ,
Weight 1.5 kg
Brand

Warranty

Platform

Supported Memory Type

Technical Specification
Specifications:
CPU LGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors
L3 cache varies with CPU
Chipset Intel® B760 Express Chipset
Memory Support for DDR4 5333(O.C.)/ 5133(O.C.)/ 5000(O.C.)/ 4933(O.C.)/ 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.)/ 4133(O.C.)/ 4000(O.C.)/ 3866(O.C.)/ 3800(O.C.)/ 3733(O.C.)/ 3666(O.C.)/ 3600(O.C.)/ 3466(O.C.)/ 3400(O.C.)/ 3333(O.C.)/ 3300(O.C.)/ 3200/ 3000/ 2933/ 2666/ 2400/ 2133 MT/s memory modules
4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
Onboard Graphics
1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz
1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
Audio
Realtek® Audio CODEC
High Definition Audio
2/4/5.1/7.1-channel
Support for S/PDIF Out
LAN Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
Wireless Communication module AMD Wi-Fi 6E RZ608 (MT7921K) (For PCB rev. 1.0)
WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
LUETOOTH 5.2
Support for 11ax 80MHz wireless standard and up to 1.2 Gbps data rate
Intel® Wi-Fi 6E AX210 (For PCB rev. 1.1)
WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
BLUETOOTH 5.3
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
Intel® Wi-Fi 6E AX211 (For PCB rev. 1.2)
WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
BLUETOOTH 5.3
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
Realtek® Wi-Fi 6E RTL8852CE (For PCB rev. 1.3)
WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
BLUETOOTH 5.3
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
Expansion Slots CPU:
1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16
Chipset:
2 x PCI Express x1 slots, supporting PCIe 3.0 and running at x1
Storage Interface CPU:
1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)
Chipset:
1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
4 x SATA 6Gb/s connectors
RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices
USB Chipset:
1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2 support
5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
2 x USB 2.0/1.1 ports on the back panel
Chipset+2 USB 2.0 Hubs:
4 x USB 2.0/1.1 ports available through the internal USB headers
Internal I/O Connectors
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
3 x system fan headers
1 x addressable LED strip header
1 x RGB LED strip header
2 x M.2 Socket 3 connectors
4 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
1 x S/PDIF Out header
1 x Q-Flash Plus button
1 x reset button
1 x reset jumper
1 x Clear CMOS jumper
Back Panel Connectors
2 x USB 2.0/1.1 ports
1 x PS/2 keyboard/mouse port
2 x SMA antenna connectors (2T2R)
1 x HDMI port
2 x DisplayPorts
3 x USB 3.2 Gen 1 ports
1 x USB Type-C® port, with USB 3.2 Gen 2 support
1 x RJ-45 port
3 x audio jacks
I/O Controller iTE® I/O Controller Chip
H/W Monitoring Voltage detection
Temperature detection
Fan speed detection
Water cooling flow rate detection
Fan fail warning
Fan speed control
BIOS
1 x 128 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Unique Features
Support for GIGABYTE Control Center (GCC)

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